COPPER PLATING CHEMICALS
CHEMICALS FOR COPPER PLATING
Copper coatings are used as the underlayer when applying multiple protective, decorative and multifunctional coatings on steel products; used to improve soldering; to create conductive layers; for the local protection of steel parts when carburizing, nitriding, boriding and other diffusion processes; in electroplating to build up metal thick layers when exemplifying art products. For copper plating both acidic and alkaline electrolytes are applied.
Simple sulfuric acid electrolytes for copper plating
ДFor electrochemical deposition of copper large number of electrolytes were developed, which can be divided into two main groups: simple (acid) electrolytes and complex (mostly alkaline). From simple acidic electrolytes sulfurous and hydrofluoboric ones found the greatest application. Acidic electrolytes are simple in structure, stable in operation, allow to perform the deposition at relatively high current densities, especially at elevated temperatures and under stirring, have current efficiency of about 100%. Copper is evolved with positive potential andcathodic polarization not exceeding 50 - 60 mV, so the copper sediments are coarse-grained, but rather dense. The main components of sulfuric acid electrolytes are copper sulphate and sulfuric acid.
Copper sulphate is the source of the metal ion coating, and sulfuric acid is needed to prevent hydrolysis of copper sulfate for increasing the conductivity of the solution. Sometimes organic additives are used to smooth the surface and make it shine.
Brightening agent for copper plating Master series
Chemical composition: Copper sulphate (Copper sulfate CuS04'5H20): 160-230 g/l Additives: Master Mu: 6 ml / l | Specification: A wide range of operating current densities, smooth, brightening, durable coatings. The stability of the electrolyte, the possibility of long-term use, no hazardous decomposition products. Widely used for copper plating of lighting elements, hardware elements etc. |
Solutions adjustment: Master Mu: 30-40 ml / KAH |
Chemical agent for copper plating 550 Series
Chemical composition: Copper sulfate: 160-230 g / l Additives: Mu 550: 6 ml / l | Specification: A wide range of operating current densities, smooth, brightening, durable coatings of metal and non-metal products and thermoplastic items. |
Solutions adjustment: 550 Mu: 30-40 ml / KAH |
Chemical agent for copper plating 210 Series
Chemical composition: Copper sulfate: 160-230 g / l Additives: Mu 210: 6 ml / l | Specification: A wide range of operating current densities, smooth, brightening, durable coatings, economical consumption of electrolyte. |
Solutions adjustment: 210 Mu: 40-50 ml / KAH |
Chemical agent for copper plating 910 Series
Chemical composition: Copper sulfate: 160-230 g / l Additives: Mu 910: 6 ml/l | Specification: A wide range of operating current densities, smooth, brightening, durable coatings, economical consumption of electrolyte. |
Solutions adjustment: 910 Mu: 30-40 ml / KAH |
Brightening agent for copper plating MB 260 series
(electrodeposition in galvanic drums)
Chemical composition: Copper sulfate: 100-150 g / l Additives: | Specification: A wide range of smooth, brightening surface, easy adjustment, maintenance and operation of the electrolyte. Electrolyte is ideal for electrodeposition in galvanic drums. |
Extra options: Anodic current density: 1-2 A / dm2 |
Complex electrolytes for copper plating
An advantage of complex electrolytes (e.g., pyrophosphate) for copper plating is the ability for depositing copper directly on steel, aluminum, molybdenum, and other metals, but can get good adhesion only with appropriate pretreatment. In complex alkaline electrolytes copper is composed of complex ions, a degree of dissociation is small, therefore requiring higher cathodic polarization. In this regard, copper sediments from complex electrolytes have fine-grained structure. A large number of complex alkaline electrolytes was developed: cyanide, pyrophosphate, ethylene diamine, ammonium and other electrolytes.
Cyanide electrolytes have best specifications: high diffusing power, fine-grained sediment, copper is directly deposited on steel has good adhesion to the substrate. However, cyanide electrolytes includes toxic substances that severely restrict their use. Worthy replacement for cyanide electrolytes are pyrophosphate electrolytes, which are simple in structure, stable and harmless. Copper is deposited at high cathodic polarization, copper sediments are dense and fine-grained. The diffusing power of the electrolyte similar to cyanide. Ammonia electrolytes and ethylenediamine electrolytes have good plastic sediments, but the first don’t enough stable due to the volatility of ammonia, and ethylenediamine electrolytes environmentally dangerous and relatively expensive, that’s why pyrophosphate copper plating electrolyte is the most appropriate.
Complex chemical agent for copper plating MC 622
Chemical composition: | Copper plating on suspensions | Copper plating drums |
|
| Potassium hydroxide | 60-100 g / l | 60-100 g / l | |
| Bluestone | 25-30 g / l | 25-30 g / l | |
| Additives: MS 622 A MS 622 B | 20-35 ml / l | 20-35 ml / l | |
| PH level | 9.0-10.5 | 9.5-11.0 | |
| Current density | 0.5-4 А/dm2 | 0.2-2 А/dm2 | |
| Temperature range: 40-60S The ratio of the anodes and cathodes 1: 2-3 Compressed air stirring, continuous filtration. | |||
Specification: active chemical agent not containing cyanide, safe for the environment suitable for aluminum alloys, copper, steel, iron, cast iron coatings, provides hard even adhesion to the basic metal surface, high resistance to impurities, simple solution adjustment.Pyrophosphate chemical agent for copper plating PCU-1
Chemical composition: Copper pyrophosphate: 75-95 g / l Solutions adjustment: | Specification: easy to use, economical to use in conjunction with brightening additives, provides solution stability, surface smoothness and a uniform coating of ideal thickness. |
Cyanide chemical agent for copper plating LM3
Chemical composition: Copper cyanide: 50-60 g / l Solutions adjustment: | Specification: The coating is smooth, dense and high quality. A wide range of current density. Easy to operate, adjust electrolyte solutions. The possibility of plating in galvanic drums and suspensions. |
Copper powder CU-200
Chemical composition: Sulphuric acid: 50-60 ml / l Solutions adjustment: | Specification: widely used for surface protection against corrosion, easy to operate, easy to maintain. |
